High Speed Full Automatic Smt Line For Electronics Production Machinery SAMSUNG SM481 Pick And Place Machine SMT Machine Solution PCB Smt Assembly Line
Description
Full Automatic SMT Machines Assembly Line
This fully automated SMT line combines cutting-edge hardware, precision engineering, and intelligent software to deliver unmatched efficiency, accuracy, and adaptability for modern electronics manufacturing. The line includes five core machines: HXT automatic vacuum laoder machine, GKG H1500 automatic solder paste printer machine, Sinictek SPI, Samsung SM481 pick and place machine, Samsung SM482 pick and place machine, JT TEA800 reflow oven machine, and HXT unloader machine.
HXT Automatic Vacuum Laoder Machine
Function: The HXT Automatic Vacuum Loader Machine is a robust, automated solution for feeding PCBs into SMT production lines, ensuring continuous operation, through advanced vacuum technology.
Key Specifications:
- PCB Handling Capacity: Maximum PCB Size: 1200 × 450 mm (supports large or elongated boards).
- PCB Thickness: Compatible with boards as thin as 0.6 mm for delicate applications.
- Storage Capacity: Holds up to 300 PCBs in its magazine, minimizing downtime for reloading.
- Performance: Conveyor Speed: Adjustable up to 9 meters/minute (150 mm/sec) for rapid transfer.
- Loading Speed: Programmable operation between 10–200 mm/sec to synchronize with downstream equipment.
- Vacuum System: Operates at 0.4–0.6 MPa air pressure for secure, damage-free PCB gripping.
- Power Supply: AC 220V ±10%, 50/60 Hz for global compatibility.
- Dimensions: Compact footprint of 1180 × 1150 × 1500 mm (L × W × H)
- Machine Weight: About 200 KG.
GKG Automatic Solder Paste Printer (H1500)
Function: Applies solder paste to PCB pads with micron-level accuracy to prepare for component placement.
Key Specifications:
- PCB Capacity: Supports boards up to 1500mm × 510 mm and thicknesses from 0.8mm to 6mm.
- Stencil Frame: Accommodates frames up to 1800mm × 750mm for large or multi-panel PCBs.
- Speed: Programmable conveyor speed up to 1500 mm/s and printing speed adjustable between 10–200 mm/sec.
- Cleaning system: Dry, Wet, Vacuum three modes
- Power: Operates on AC 220V ±10%, 2.2KW,
- Dimensions: housed in a compact 2570mm x 1348mm × 1633mm.
- Machine Weight: About 1500 KG.
Snictek 3D SPI Machine (S8080)
- Function: The Sinictek 3D SPI (Solder Paste Inspection) Machine is an advanced optical inspection system used in Surface Mount Technology (SMT) production lines to analyze the quality of solder paste deposits on printed circuit boards (PCBs).
Key Specifications:
- PCB Compatibility: Maximum PCB Size: 450 mm × 500 mm (suitable for medium to large boards).
- Thickness Range: Typically supports PCBs from 0.4 mm to 6 mm (varies by model).
- Principle: 3D white light Phase-Shifting Light Modulation (PSLM) and Phase Measurement
- Profilometry (PMP), enabling high-precision 3D topography mapping.
- Inspection Speed: 0.35–0.5 seconds per Field of View (FOV), balancing speed and accuracy for high-throughput lines.
- Power: Typically operates on AC220V, 50/60Hz (varies by configuration).
- Mark-Point Detection: 0.3 seconds per piece for rapid PCB alignment.
Conveyor Adjustment: Manual and automatic width adjustment (50–450 mm), accommodating diverse PCB sizes without downtime.
- Machine dimensions: 1000 mm × 1150 mm × 1530 mm (compact footprint for easy integration). Weight: 965 KG.
Hanwha SMT Pick and Place Machine (SM481)
- Function: Precision placement of surface-mount components onto PCBs.
Key Specifications:
- Placement Speed: 40,000 CPH with 10 placement heads for rapid throughput.
- Component Range: Handles 0402-sized chips (0.4 × 0.2 mm), , IC, BGA and maximum component height 15mm.
- Vision System: Equipped with a flying camera for real-time component alignment and inspection.
- PCB maximum Sizee: 460mm × 400mm for multi-board panels.
- Power and Dimension: Requires 0.5 - 0.7MPa air pressure. Machine size 1650mm × 1680mm × 1530mm and the machine weigh is 1655 KG.
Hanwha SMT Pick and Place Machine (SM482)
- Function: Precision placement of surface-mount components onto PCBs.
Key Specifications:
- Placement Speed: 30,000 CPH with 6 placement heads for rapid throughput.
- Component Range: Handles 0402-sized chips (0.4 × 0.2 mm), , IC, BGA and maximum component height 15mm.
- Vision System: Equipped with a flying camera for real-time component alignment and inspection.
- PCB maximum Sizee: 460mm × 400mm for multi-board panels.
- Power and Dimension: Requires 0.5 - 0.7MPa air pressure. Machine size 1650mm × 1680mm × 1530mm and the machine weigh is 1600 KG.
JT Reflow Oven Machine (TEA-800)
- Function: Lead free hot air melts solder paste to form permanent electrical connections between components and PCBs.
Key Specifications:
- Heating Zones: 8 zones (8 upper/ 8 lower) over 2800 mm, enabling precise thermal profiling.
- Cooling Zone: UP 2 cooling zone to prevent warping.
- Conveyor System: Chain-driven transport adjustable from 3000–2000 mm/min, handling PCBs up to 4000 mm wide.
- Temperature Control: Range up to 300°C, with 3-phase 380V power and 30KW operating consumption.
- Dimension: 5220mm × 1430mm × 1530mm, designed for high-throughput environments.
HXT Unloader Machine
- Function: Automatically offloads processed PCBs post-reflow for downstream handling.
Key Specifications:
- Modular Design: Configurable with 1–4 tables and 1–2 robotic arms to match production demands.
- PCB Compatibility: Manages single-sided LED boards and standard PCBs, including long boards up to 1.2 meters.
- Flexibility: Small PCBs use 4 arms with 4 tables for parallel processing; larger boards use 1–2 arms with 1–2 tables.
Applications:
This fully automated SMT line is suitable for industrial products, Consumer electronic, LED display, TV back light, and Home appliances.
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Efficient Electronics Pick And Place Machine High Accuracy With 0.6mm Thickness Boards Images
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